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SOD-123HE Diode
SOD-123HE Diode Back
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Introduction 1.With ultra-thin package shape, it can be used in miniaturized and thin circuits；
2.The bottom side of the package has a heat sink, which has excellent heat dissipation performance；
3.There are many kinds of packaging chips, including GPP, DB, Schottky, FRED, TVS and other chips;
4. The product is made of environment-friendly materials and meets RoHS standards
5. Products are widely used in secondary rectifier circuits, converters, freewheeling diodes, AC/DC power protection and so on.
Features 1. Excellent heat dissipation performance: the back pad has large area, good heat dissipation performance and strong flow capacity, which can meet the requirements of high-temperature applications
2、Thin package shape ：the package shape is thinner than SOD-123FL package and meets the development trend of packaging thinness
SPECIFICATION
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